Component Packaging
NJMET /Metropolitan Labs is proud to present a
Contract Assembling and Packaging Service in
order to accommodate the demanding request of custom packaging,
diminishing source manufacturing or obsolete production of components
requiring the demand of re-manufacturing
 Component
Assembly / Packaging
 Custom assembly of a diversity of packages featuring:
- C-DIP
- P-DIP
- FLAT PACK
- PLCC
- LCC
- PGA
- QFP
- SOIC
- CQFP
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- METAL CAN (VARIOUS)
- BGA
- PQA
- HYBRID
- FR MODULE
- TSOP
- SIP
- J LEAD
- GULL WING
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Wafer / Die
Acquisition and Preparation
Acquisition of any wafer - die in conjunction with precision cutting in
preparation for assembly or shipment to your valued customer.
Pre - Cap Visual
Inspection
Die visual inspection to commercial, MIL-STD-750 & 883 (class B or class
S) levels
Electrical
Testing
Post assembly electrical testing to meet commercial, military,
industrial and automotive performance requirements accommodating
SSI-VHLSI component technology
Component
Screening and Qualifications
Post assembly component screening and qualification to meet MIL-STD-750
& 883 (class B or class S) levels in conjunction with custom aerospace
design requirements
Marking
Custom marking to commercial or MIL-STD-130 levels in conjunction with
providing resistance to solvents (permanency) evaluation for marking
quality and durability.
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