Reliability Testing / Screening / Qualifications

  • Thermal Shock
  • Temperature Cycling
  • Constant Acceleration (Centrifuge)
  • Physical (Mechanical) Dimensions
  • Internal Water Vapor Content
  • RGA: Residual Gas Analysis
  • Die Shear 
  • Compression Molding (Micro-Sectioning)
  • Surge Current
  • Capacitance, DWV, IR, Resistance
  • Burn-In Static / Dynamic
  • Life Test
  • Bond Strength
  • Mechanical  Shock / Vibration
  • Stabilization Bake
  • Humidity Conditioning
  • Moisture Resistance
  • Salt Atmosphere
  • High Temperature Reverse Bias
  • HAST/Highly Accelerated Stress Test
  • Endurance Testing
  • Thermal Impedance
  • Hermeticity Test (Fine & Gross Leak)
  • Marking Permanency Test - Mil-Std
  • Solvent Test for Remarking (destructive)
  • Solvent Test for Resurfacing (destructive)
  • Physical Dimension
  • Lead Finish Evaluation
  • Lead Fatigue Test / Terminal Strength
  • Adhesion to Lead Finish
  • Report Generation
  • De-lid / De-capsulation Internal Analysis
  • Radiographic (X-ray) Inspection
  • SEM: Scanning Electron Microscopy
  • Quantitative Surface Analysis
  • Scanning Acoustic Microscopy (SAM)
  • PIND: Particle Impact Noise Detection
  • XRF (non-destructive)
  • EDS/EDX (destructive)
  • Battery Screening / Qualifications
  • Data Retention Testing